Composite material

ABSTRACT

A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. The composite material compressed by 10% has a reaction force of 0.1 kPa to 1000 kPa, and the composite material has a heat conductivity of 0.5 W/(m·K) or more. The heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard (ASTM) D5470-01.

TECHNICAL FIELD

The present invention relates to a composite material.

BACKGROUND ART

Efforts have been made to increase the heat conductivity of materials,such as foam materials, having a plurality of voids.

For example, Patent Literature 1 discloses a composite materialincluding: scaly fillers formed of an inorganic material; and a bindingresin formed of a thermosetting resin binding the fillers. Thiscomposite material is a foam material in which a plurality of voids aredispersed, and the fillers accumulate on inner walls of the voids suchthat flat surfaces of the fillers overlap each other (claim 1 and FIG. 1). According to Patent Literature 1, the flat surfaces of the fillersare less likely to overlap each other when a ratio, namely, an aspectratio, of an average length of the flat surfaces of the fillers to athickness of the filler is less than 50.

A composite material including an inorganic filler but having excellentthermal insulation properties was also proposed. Patent Literature 2discloses a polyurethane foam obtained from a composition including apolyol, a blowing agent, a layered clay mineral, etc. This compositematerial has a high closed cell rate, and the layered clay mineral whichis an inorganic filler is uniformly dispersed therein.

CITATION LIST Patent Literature

-   Patent Literature 1: JP 2018-109101 A-   Patent Literature 2: JP 2009-191171 A

SUMMARY OF INVENTION Technical Problem

Commonly, as the amount of inorganic particles included as a filler in acomposite material is increased to improve the heat conductivity, theeffect of the inorganic particles on properties other than heatconductivity becomes greater. The present invention aims to provide anew composite material for which this tendency is mitigated.

Solution to Problem

The present invention provides a composite material including

a solid portion including inorganic particles and a resin, wherein

the composite material has a porous structure including a plurality ofvoids surrounded by the solid portion,

the composite material compressed by 10% has a reaction force of 0.1 kPato 1000 kPa, and

the composite material has a heat conductivity of 0.5 W/(m·K) or more,where the heat conductivity is a value measured for one test specimen ina symmetric configuration according to an American Society for Testingand Materials (ASTM) standard D5470-01.

In another aspect, the present invention provides a composite materialincluding

a solid portion including inorganic particles and a resin, wherein

the composite material has a porous structure including a plurality ofvoids surrounded by the solid portion,

the composite material has a compressive elastic modulus of 100 kPa to600 kPa, and

the composite material has a heat conductivity of 0.5 W/(m·K) or more,where the heat conductivity is a value measured for one test specimen ina symmetric configuration according to an American Society for Testingand Materials (ASTM) standard (ASTM) D5470-01.

Advantageous Effects of Invention

The present invention can provide a composite material easily changingits shape in response to a compressive force even when including theinorganic particles such that the heat conductivity is 0.5 W/(m·K) ormore.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view schematically showing an example of acomposite material according to the present embodiment.

FIG. 2 is a cross-sectional view schematically showing another exampleof the composite material according to the present embodiment.

FIG. 3 illustrates a measurement position in the composite materialaccording to the present embodiment measured by energy dispersive X-rayspectroscopy using an ultra-high-resolution field-emission scanningelectron microscope.

FIG. 4 shows the results of optical microscope observation of across-section of a composite material according to Sample 1.

DESCRIPTION OF EMBODIMENTS

Embodiments of the present invention will be described hereinafter withreference to the drawings. The following description describes examplesof the present invention, and the present invention is not limited tothe following embodiments.

As shown in FIG. 1 , a composite material 1 according to the presentembodiment includes a solid portion 10. The solid portion 10 includesinorganic particles 20 and a resin 30. For example, the compositematerial 1 has a porous structure including a plurality of voids 40 incontact with each other via the inorganic particle 20 or directlywithout the inorganic particle 20. For example, at least a portion ofthe inorganic particles 20 is present on a wall surface of the solidportion 10, the wall surface facing the void 40. Heat transmission paths5 and 6 stretch, for example, through the plurality of voids 40, thatis, along the plurality of voids 40. The heat transmission paths 5 and 6are formed of the plurality of inorganic particles 20 arrangedcontinuously, i.e., in contact with each other or close to each other.The heat transmission paths 5 and 6 stretch, for example, withoutextending through the inside of the solid portion 10, more specifically,along the wall surface of the solid portion 10. For example, some of theheat transmission paths 5 stretch from a surface 1 a of the compositematerial 1 to a surface 1 b on the opposite side thereof.

The composite material 1 compressed by 10% has a reaction force of 0.1kPa to 1000 kPa. The reaction force of the composite material compressedby 10% may be 0.5 kPa to 950 kPa or 1 kPa to 900 kPa. The reaction forceof the composite particles 1 compressed by 10% can be determined, forexample, according to JIS K 7181: 2011 or JIS K 7220: 2006. The reactionforce of the composite particles 1 compressed by 10% can be measured,for example, using RSA-G2 manufactured by TA Instruments Japan Inc.

The composite material 1 has a compressive elastic modulus of 100 kPa to600 kPa. The compressive elastic modulus can be determined, for example,by using an apparatus for dynamic viscoelastic measurement (DMA). Thecompressive elastic modulus of the composite material 1 can becalculated, for example, from stress values of the composite material 1and strain values of the composite material 1. The stress values and thestrain values are obtained for every 0.2% compression by compressing a25 mm² principal surface of the composite material 1 having a thicknessof 4 mm by 0% to 5% at a compression rate of 0.01 mm/s. The method forcalculating the compressive elastic modulus of the composite material 1is described in EXAMPLES.

The compressive elastic modulus may be 200 kPa to 580 kPa or 250 kPa to570 kPa. The upper limit of the compressive elastic modulus may be, insome cases, 550 kPa.

The composite material 1 can exhibit a high heat conductivity. Thecomposite material 1 has a heat conductivity of, for example, 0.5W/(m·K) or more. The heat conductivity of the composite material 1 canbe preferably 0.55 W/(m·K) or more, more preferably 0.6 W/(m·K) or more,and, in some cases, 0.7 W/(m·K) or more. The upper limit of the heatconductivity is not limited to a particular value. The upper limit ofthe heat conductivity may be, for example, 2.2 W/(m·K), 2.1 W/(m·K), or2.0 W/(m·K). The heat conductivity of the composite material 1 is, forexample, a value measured for one test specimen in a symmetricconfiguration according to an American Society for Testing and Materials(ASTM) standard (ASTM) D5470-01.

The composite material 1 has, for example, an Asker C hardness of 10 to50. In this case, the composite material 1 can have an appropriatestiffness to be a composite material that more easily changes its shape.The Asker C hardness is, for example, a value measured according toJapanese Industrial Standards (JIS) K 7312: 1996. The Asker C hardnessmay be 15 to 47 or 18 to 45.

To form, as in the technique described in Patent Literature 1, a heattransmission path via a route including voids spaced from each other,inorganic particles need to connect outer surfaces of the voids spacedfrom each other in the solid portion 10. Therefore, the aspect ratio ofthe inorganic particle needs to be set high. On the other hand,according to the embodiment shown in FIG. 1 , even when the aspect ratioof the inorganic particle 20 is not high, the heat transmission paths 5and 6 are formed and the composite material 1 can exhibit high heatconduction performance. The composite material 1 does not need toinclude the inorganic particle 20 by which the voids 40 adjacent to eachother are connected and which is, between the voids 40 adjacent to eachother, surrounded by the solid portion 10.

It should be noted that all heat transmission paths not necessarilyappear in a particular cross-section as shown in FIG. 1 and that allportions of a particular heat transmission path not necessarily appearin a particular cross-section as shown in FIG. 1 . For example, in FIG.1 , the heat transmission path 6 does not seem to stretch to the surface1 b. Actually, however, the heat transmission path 6 stretches via theinorganic particles not appearing in this cross-section and reaches thesurface 1 b. Similarly, it is impossible to confirm in a particularcross-section that every void is in contact with another void. Forexample, a void 50 seems to be isolated in FIG. 1 . Actually, however,the void 50 is in contact with another void adjacent thereto in athickness direction of the page.

However, not all heat transmission paths need to stretch from thesurface 1 a to the surface 1 b. Moreover, not every void included in theporous structure needs to be in contact with another void directly orvia the inorganic particle.

The resin 30 is not present at connecting portions 41 and 43. The resin30 and the inorganic particle 20 are not present at the connectingportion 41. The voids 40 directly in contact with each other at theconnecting portion 41 communicate to each other to form one space. Thevoids 40 in contact with each other at the connecting portion 43 atwhich inorganic particles 21 are present may communicate to each othervia a small gap between the inorganic particles 21 to form one space ormay be present as spaces separated from each other. However, the voids40 that seem to be in contact with each other via the inorganic particle21 in FIG. 1 may be directly in contact with and communicate to eachother in a cross-section different from the one in FIG. 1 .

As shown in FIG. 2 , a particle 60 may be present inside the void 40.The particle 60 is typically a resin particle. The resin particle may bea later-described first resin. The particle 60 can be the first resinshrunk by a heat treatment. The resin particle before shrinking may bein a shape corresponding to the void 40. The resin occupying the voidmay be removed as shown in FIG. 1 , or may deform and remain as shown inFIG. 2 . In the latter case, the particle 60 may be in contact with theinorganic particle 20. In a particular cross-section, presence of theparticle 60 cannot be confirmed inside of the void 50; however, inanother cross-section, presence of the particle 60 may be confirmedinside the same void 50. In the embodiment shown in FIG. 2 , theparticle 60 is present in at least some of the voids 40 and 50, theparticle 60 being smaller than the at least some of the voids 40 and 50.

The inorganic particles 20 around the void 40 may be exposed to the void40 or does not need to be exposed to the void 40. A surface layerincluding no inorganic particles 20 may be present between the wallsurface of the void 40 and the inorganic particles 20 that are presentcontinuously along the periphery of the void 40, i.e., in contact witheach other or close to each other.

The material of the inorganic particle 20 is not limited to a particularmaterial as long as, for example, the inorganic particle 20 has a higherheat conductivity than the heat conductivity of the resin 30. Examplesof the material of the inorganic particle 20 include hexagonal boronnitride (h-BN), alumina, crystalline silica, amorphous silica, aluminumnitride, magnesium oxide, carbon fibers, silver, copper, aluminum,silicon carbide, graphite, zinc oxide, silicon nitride, silicon carbide,cubic boron nitride (c-BN), beryllia, and diamond. The shape of theinorganic particle 20 is not limited to a particular shape. Examples ofthe shape of the inorganic particle 20 include sphere-like, rod-like(including short-fiber), scaly, and granular shapes. The “granular”shape refers to, for example, the shape of the plurality of inorganicparticles 20 aggregated using a binder or a sintered body of theplurality of inorganic particles 20.

The aspect ratio of the inorganic particle 20 is not limited to aparticular value. The aspect ratio of the inorganic particle 20 may beless than 50, 40 or less, or even 30 or less. The aspect ratio of theinorganic particle 20 may be 1 or more, or may be a greater value, e.g.,2 or more or even 3 or more. The aspect ratio is defined as a ratio(maximum diameter/minimum diameter) of a maximum diameter of theparticle to a minimum diameter of the particle, unless otherwisespecified. Herein, the minimum diameter is defined as a shortest linesegment passing through a midpoint of a line segment defined as themaximum diameter.

The average particle diameter of the inorganic particles 20 is notlimited to a particular value. The average particle diameter of theinorganic particles 20 is, for example, 0.05 μm to 100 μm, and may be0.1 μm to 50 μm, 0.1 μm to 30 μm, or 0.5 to 10 μm. The average particlediameter can be determined, for example, by laserdiffraction-scattering. The average particle diameter is, for example, a50% cumulative value (median diameter) d₅₀ determined from a particlesize distribution curve, in which a frequency is represented by avolume-based fraction, obtained using a particle size distributionanalyzer (Microtrac MT3300EXII) manufactured by MicrotracBEL Corp.

The shape of the inorganic particle 20 can be determined, for example,by observation using, for example, a scanning electron microscope (SEM).For example, the inorganic particle 20 is considered to have asphere-like shape when the aspect ratio (maximum diameter/minimumdiameter) thereof is 1.0 or more and less than 1.7, particularly 1.0 ormore and 1.5 or less, or even 1.0 or more and 1.3 or less and at least aportion of an outline of the inorganic particle 20 observed,particularly, substantially the entire outline of the inorganic particle20 observed, is a curve.

The “scaly” shape refers to the shape of a plate having a pair ofprincipal surfaces and a lateral surface. The term “principal surface”of the inorganic particle 20 refers to a face thereof having the largestarea, and is typically a substantially flat face. When the inorganicparticle 20 has a scaly shape, the aspect ratio is defined as a ratio ofan average dimension of the principal surfaces to the average thickness,instead of the above definition. The thickness of the scaly inorganicparticle 20 refers to the distance between the pair of principalsurfaces. The average thickness can be determined by measuringthicknesses of any 50 inorganic particles 20 using a SEM and calculatingthe average of the thicknesses. A value of d₅₀ measured using the aboveparticle size distribution analyzer can be used as the average dimensionof the principal surfaces. The aspect ratio of the scaly inorganicparticle 20 may be 1.5 or more, 1.7 or more, or even 5 or more.

Examples of the rod-like shape include stick-like shapes such asstick-like, columnar, tree-like, needle-like, and conical shapes. Theaspect ratio of the rod-like inorganic particle 20 may be 1.5 or more,1.7 or more, or even 5 or more. Examples of the upper limit of theaspect ratio are as described above regardless of the shape of theinorganic particle 20.

When the inorganic particles 20 have a sphere-like shape, the averageparticle diameter thereof is, for example, 0.1 μm to 50 μm, preferably0.1 μm to 10 μm, and more preferably 0.5 μm to 5 μm. When the inorganicparticle 20 has a rod-like shape, a length of a minor axis of theinorganic particle 20 is, for example, 0.01 μm to 10 μm and preferably0.05 μm to 1 μm. When the inorganic particle 20 has a rod-like shape, alength of a major axis of the inorganic particle 20 is, for example, 0.1μm to 20 μm and preferably 0.5 μm to 10 μm. When the inorganic particles20 have a scaly shape, the average dimension of the principal surfacesof the inorganic particles 20 is, for example, 0.1 μm to 20 μm andpreferably 0.5 μm to 15 μm. When the inorganic particle 20 has a scalyshape, the thickness of the inorganic particle 20 is, for example, 0.05μm to 1 μm and preferably 0.08 μm to 0.5 μm. When the inorganic particle20 has a rod-like shape, the minimum diameter (commonly the length ofthe minor axis) of the inorganic particle 20 is, for example, 0.01 μm to10 μm and preferably 0.05 μm to 1 μm. When the inorganic particle 20 hasa rod-like shape, the maximum diameter (commonly the length of the majoraxis) of the inorganic particle 20 is, for example, 0.1 μm to 20 μm andpreferably 0.5 μm to 10 μm. When the size of the inorganic particle 20is in these ranges, the inorganic particles 20 are likely to be placedalong the void 40, the heat transmission path 5 stretching through theplurality of voids 40 can be reliably formed. When the inorganicparticles 20 have a granular shape, the average particle diameterthereof is, for example, 10 μm to 100 μm, and preferably 20 μm to 60 μm.

The amount of the inorganic particles 20 in the composite material 1 isnot limited to a particular value. The amount of the inorganic particles20 in the composite material 1 is, for example, 10 mass % to 80 mass %,preferably 10 mass % to 70 mass %, and more preferably 10 mass % to 55mass %. The amount of the inorganic particles 20 in the compositematerial 1 is, for example, 1 volume % to 50 volume %, preferably 2volume % to 45 volume %, more preferably 5 volume % to 40 volume %, andparticularly preferably 5 volume % to 30 volume %. The compositematerial 1 can exhibit higher heat conduction performance and anappropriate rigidity by appropriate adjustment of the amount of theinorganic particles 20.

The amount [mass %] of the inorganic particles 20 in the compositematerial 1 can be determined by removing a material other than theinorganic particle 20 from the composite material 1 by, for example,burning. For accurate measurement, the amount [mass %] of the inorganicparticles may be calculated by element analysis. Specifically, an acidis added to the composite material 1, and a microwave is applied to theacid and the composite material 1 for acid decomposition of thecomposite material 1 under pressure. For example, hydrofluoric acid,concentrated sulfuric acid, concentrated hydrochloric acid, aqua regia,or the like can be used as the acid. Element analysis is performed by aninductively coupled plasma atomic emission spectroscopy (ICP-AES) for asolution obtained by the acid decomposition under pressure. The amount[mass %] of the inorganic particles 20 can be determined on the basis ofthe analysis result.

The amount [volume %] of the inorganic particles 20 in the compositematerial 1 can be determined from the mass and density of the inorganicparticles 20 included in the composite material 1 and the volume andvoid ratio of the composite material 1. Specifically, a volume A of theinorganic particles 20 in the composite material 1 is calculated fromthe mass and density of the inorganic particles 20. Separately, a volumeB of the composite material 1 is calculated on the basis of the voidratio of the composite material 1, the volume B not including the volumeof the voids 40. The amount [volume %] of the inorganic particles 20 canbe determined by (A/B)×100. The method for calculating the void ratiowill be later described.

The density of the inorganic particles 20 can be determined according toJapanese Industrial Standards (JIS) R 1628: 1997 or JIS Z 2504: 2012 forthe inorganic particles 20 left over after burning an organic materialby heating the composite material 1 in an electric furnace at hightemperatures.

At least a portion of the inorganic particles 20 is present on the wallsurface of the solid portion 10, the wall surface facing the voids 40.Other portions 21 and 22 of the inorganic particles 20 may be present atthe connecting portion 43 between the voids 40. On the wall surface ofthe solid portion 10, a portion 23 of the inorganic particles 20 may bestacked on another inorganic particle 20. At least a portion of theinorganic particles 20 is in contact with or very close to the inorganicparticle adjacent thereto and form a portion of the heat transmissionpaths 5 and 6. However, another portion 24 of the inorganic particles 20may be surrounded by the resin 30. In other words, the solid portion 10can include the inorganic particle 24 not in contact with the void 40.

Substantially all the inorganic particles 20 may each be present on thewall surface of the solid portion 10 or at the connecting portion 41 or43 between the voids 40. Herein, the term “substantially all” means 70mass % or more, even 80 mass % or more, and particularly 90 mass % ormore. In this embodiment, a proportion of the inorganic particlescontributing to improvement of the heat conductivity is higher.Distribution of the inorganic particles 20 inside the solid portion 10can be analyzed, for example, using an ultra-high-resolutionfield-emission scanning electron microscope by energy dispersive X-rayspectroscopy.

A portion of the wall surface of the solid portion 10 may be formed of amaterial, typically the resin 30, other than the inorganic particle 20,the wall surface facing the void 40. The resin 30 is, for example, alater-described second resin.

The resin 30 of the solid portion 10 is, for example, a crosslinkingpolymer, and specifically a thermosetting resin. Examples of thethermosetting resin include phenolic resins, urea resins, melamineresins, diallyl phthalate resins, polyester resins, epoxy resins,aniline resins, silicone resins, furan resins, polyurethane resins,alkylbenzene resins, guanamine resins, xylene resins, and imide resins.A curing temperature of the resin is, for example, 25° C. to 160° C.

Outer shapes of the voids 40 and 50 may be in a sphere-like shape, andmay be substantially spherical. Herein, the term “substantiallyspherical” means that a ratio (maximum diameter/minimum diameter) of themaximum diameter to the minimum diameter is 1.0 to 1.5, particularly 1.0to 1.3. However, the outer shapes of the voids 40 and 50 are not limitedto particular shapes. The outer shapes of the voids 40 and 50 may be arod-like or polyhedral shape, or may be an ellipsoidal shape having toolarge a ratio of the maximum diameter to the minimum diameter to callthe shape a sphere-like shape. 50% or more or even 80% or more of thevoids 40 and 50 may have a sphere-like shape. It is difficult to formvoids having shapes as uniform as the above by a foaming technique, bywhich irregularly shaped voids are formed.

The average diameter of the voids 40 is not limited to a particularvalue. The average diameter of the voids 40 is, for example, 50 μm to5000 μm, preferably 100 μm to 2000 μm, and more preferably 300 μm to1500 μm. Herein, the “average diameter” of the voids 40 refers to theaverage of diameters thereof determined by observation of across-section of the composite material 1 using a SEM. Specifically, anyone hundred voids 40 that are each observable entirely are measured fortheir maximum and minimum diameters, the average of the maximum andminimum diameters of each void is defined as the diameter of the void,and the average of the diameters of fifteen voids having the largest tofifteenth largest diameters is defined as the “average diameter”.However, depending on the size of the voids 40, an optical microscopemay be used instead of a SEM to measure the average diameter of thevoids 40. It should be noted that when the particle diameters of thefirst resins used in a later-described composite material manufacturingmethod are highly uniform, the particle diameters of the first resinsand the average diameter of the voids of the composite material aresubstantially the same and any of the particle diameters of the firstresins is considered the average diameter of the voids of the compositematerial.

In the composite material 1, a ratio of the volume of the voids 40 tothe volume of the composite material 1, namely, the void ratio, is notlimited to a particular value. The void ratio is, for example, 10 volume% to 60 volume %, preferably 15 volume % to 50 volume %, and morepreferably 20 volume % to 45 volume %.

The void ratio can be determined by observing a cross-section of thecomposite material 1 using a SEM, calculating a ratio of the total areaof the voids 40 to the total area observed, and averaging thus-obtainedratios in 10 images of different cross-sections. However, the void ratiomay be determined in the following manner only when the manufacturingprocess is known. From the mass of the later-described first resin andthe mass of the composite particle in which the inorganic particles 20are placed on a surface of the first resin, the mass of the inorganicparticles 20 included in the composite particle is calculated.Separately, the amount [mass %] of the inorganic particles 20 in thecomposite material 1 is calculated by inorganic element analysis. Themass of the inorganic particles 20 in the composite material 1 iscalculated from the amount [mass %] of the inorganic particles 20 andthe mass of the composite material 1. The number of composite particlesused to manufacture the composite material 1 is calculated from the massof the inorganic particles 20 in the composite material 1 and the massof the inorganic particles 20 included in the composite particle. Thevolume of the void 40 is calculated from the average diameter of thevoids 40. The total volume of the voids 40 in the composite material 1is determined by multiplying the volume of the void 40 by the number ofthe composite particles. The total volume of the voids 40 in thecomposite material 1 is divided by the volume of the composite material1 to calculate the void ratio.

The plurality of voids 40 may have substantially similar outer shapes.Herein, the term “substantially similar” means that on a number basis,80% or more, particularly 90% or more, of the voids 40 have the sametype of a geometric shape, for example, a sphere-like or regularpolyhedron shape. The outer shapes of the substantially similar voids 40preferably have sphere-like shapes. The outer shapes thereof may besubstantially spherical. A plurality of voids formed by foaming can alsocome in contact with each other as a result of expansion. However, inthis case, an internal pressure caused by foaming commonly acts on aconnecting portion between the voids, greatly deforming a vicinity ofthe connecting portion. Therefore, it is virtually impossible to form aplurality of voids in contact with each other and having substantiallysimilar outer shapes by a foaming technique.

The porous structure may have a through hole extending from oneprincipal surface to the other principal surface of the compositematerial 1. When the composite material 1 has a plate shape, the voidprovided on one principal surface of the composite material 1 maycommunicate to a space facing the other principal surface of thecomposite material 1. The void provided on one principal surface of thecomposite material 1 may communicate to a space in contact with alateral face adjacent to the one principal surface of the compositematerial 1. With such structural features, the composite material 1 canhave both heat conductivity and air permeability. Herein, the term“principal surface” of the composite material 1 refers to a surfacethereof having the largest area.

The plurality of voids 40 may be locally in contact with each other. Inthis case, the strength of the composite material 1 is unlikely to bedecreased even when the void ratio is increased. The diameter of acommunicating portion allowing communication between the voids at theconnecting portion 41 may be 25% or less, 20% or less, or even 15% orless of the average diameter of the voids 40. The diameter of thecommunicating portion can be measured by a SEM or X-ray CT, as for theaverage diameter. Since the inorganic particle 21 separates the voids 40at the connecting portion 43, there is no communicating portion at theconnecting portion 43.

In the composite material 1 according to the present embodiment, forexample, a value P₀ determined by the following equation (1) may be 30or more. In this case, the composite material 1 whose physicalproperties and functions, such as elastic modulus, hardness,shock-absorbing properties, and anti-vibration properties, are unlikelyto vary can be obtained. Moreover, in this case, the amount of theinorganic particles 20 used can be reduced and thus the manufacturingcost of the composite material 1 can be reduced.

P ₀=(the average diameter[μm]of the voids 40/the average particlediameter[μm]of the inorganic particles 20)×(the void ratio[volume%]/100)  Equation (1)

The upper limit of the value P₀ is not limited to a particular value.The upper limit of the value P₀ is, for example, 1000, preferably 700,more preferably 500, and particularly preferably 450.

As is obvious from the above description, the composite material 1 maybe a non-foam body. Conventional foam bodies as described in PatentLiterature 1 cannot have characteristic structures as shown in FIGS. 1and 2 , namely, structures in which placement of the inorganic particles20 is controlled delicately and precisely.

An example of a method for determining herein a measurement region fordetermining elemental composition in a particular region of thecomposite material 1 will be described with reference to FIG. 3 . First,the void 40 of the composite material 1 is observed using a SEM. Themaximum diameter of the void 40 observed using the SEM was measured, anda line segment A having a length L of the maximum diameter is defined.Next, a line segment B passing through a midpoint of the line segment Ato be perpendicular to the line segment A is defined, the line segment Bhaving a length L′ from one end of the void 40 to the other end of thevoid 40. Furthermore, a rectangle C having a center of gravity at themidpoint of the line segment A is defined, the rectangle C having afirst side and a second side adjacent to the first side, the first sidebeing parallel to the line segment A and having a length (2L in adirection parallel to the line segment A) twice as long as the linesegment A, the second side being parallel to the line segment B andhaving a length (2L′ in a direction parallel to the line segment B)twice as long as the line segment B. A region determined by removing avoid portion from the rectangle C is defined as a measurement region.

This measurement region is divided into a plurality of regions D eachdefined by a 50-μm square. For each of the plurality of regions D, aproportion of an atom included in the region D is analyzed. For example,energy dispersive X-ray spectroscopy using an ultra-high-resolutionfield-emission scanning electron microscope is employed for theanalysis.

As a result of the above analysis of the plurality of regions D, alargest proportion [atomic %] of the atom (e.g., B) included in theinorganic particle(s) is defined as Y, the largest proportion beingdetermined for one of the plurality of regions D. Similarly, a smallestproportion [atomic %] of the atom (e.g., B) included in the inorganicparticle(s) is defined as X, the smallest proportion being determinedfor another one of the plurality of regions D. Y/X satisfies, forexample, a relation Y/X≥2. The lower limit of Y/X may be 2.2, 2.5, or,in some cases, 3.0. The upper limit of Y/X is not limited to aparticular value. The upper limit of Y/X may be 10 or 9.5. When theinorganic particle is formed of a compound, the atom to be analyzed isrecommended to be an element of a cation in the compound. When theinorganic particle is formed of a simple substance, the atom to beanalyzed is recommended to be an element forming the simple substance.For example, when the inorganic particle is formed of boron nitride(BN), the atom to be analyzed is boron (B). When the inorganic particleis formed of alumina (Al₂O₃), the atom to be analyzed is aluminum (Al).

The region D for which Y is determined may be a region having noadditional void between the region D and the void 40, i.e., a regionadjacent to the void 40. In the present embodiment, a value Q determinedby the following equation is, for example, 65 or more. The value Q maybe 68 or more or 70 or more. The maximum of the value Q is not limitedto a particular value. The maximum of the value Q may be 100 or 95.

Q=100×Y/(Y+X)

<Composite Material Manufacturing Method>

An example of a method for manufacturing the composite material 1according to the present embodiment will be described hereinafter.

The composite material 1 includes: the solid portion 10 including asecond resin; and the plurality of voids 40. The method formanufacturing the composite material 1 includes, in the following order:charging a fluid in a gap of a particle aggregate including a pluralityof first resins, which are typically resin particles, the fluidincluding a second resin or a precursor of the second resin; andshrinking or removing the plurality of resin particles by heating theplurality of resin particles to form the plurality of voids 40. Surfacesof the plurality of resin particles include the plurality of theinorganic particles 20.

First, a mixture of the first resin and an adhesive is produced toobtain the composite particles. The adhesive is an adhesive for adheringthe inorganic particles 20 to the surface of the first resin particle.The adhesive includes, for example, polyethylene glycol (PEG) and/or anemulsion. Next, the inorganic particles 20 are added to and mixed withthe mixture to obtain composite particles in which the inorganicparticles 20 are placed on the surface of the first resin. The mixingmethod is not limited to a particular method. Examples of the mixingmethod include mixing using a ball mill, a bead mill, a planetary mixer,an ultrasonic mixer, a homogenizer, or a planetary centrifugal mixer.

Next, the composite particles are put in a mold such that the compositeparticles are in contact with each other to form a particle aggregate. Afluid separately prepared is further added to the mold to prepare amixed body. The fluid includes the second resin. The fluid may includethe precursor of the second resin. The fluid is charged in the gap ofthe particle aggregate in which at least two of the plurality ofcomposite particles are in contact with each other. The fluid is presentat least on a surface of the composite particle and in a portion wherethe composite particles are in contact with each other. In this manner,the aggregate of the composite particles is formed in which at least twoof the plurality of composite particles are in contact with each othersuch that a heat transmission path formed of the inorganic particles 20in contact with each other stretches along the surfaces of the pluralityof composite particles.

Next, bubbles are removed from the mixed body. The method for removingbubbles from the mixed body is not limited to a particular method. Anexample of the method is degassing under reduced pressure. Degassingunder reduced pressure is performed, for example, at 25° C. to 200° C.for 1 second to 10 seconds.

Subsequently, the flowability of the fluid is decreased by heating themixed body. Heating of the fluid causes progression of, for example, areaction of generating the second resin from the precursor of the secondresin or curing of the second resin, thereby decreasing the flowabilityof the fluid. The solid portion 10 including the second resin isgenerated in this manner. A precursor of the composite material can beobtained in this manner.

Next, the composite material 1 is produced by shrinking the first resinor removing the first resin from the precursor of the compositematerial. The method for shrinking the first resin or removing the firstresin from the precursor of the composite material is not limited to aparticular method. Examples of the method include a method in which theprecursor of the composite material is heated and a method in which theprecursor of the composite material is immersed in a particular solvent.These methods may be used in combination. The voids 40 are formed byshrinking or removing the first resins. In this manner, the inorganicparticles 20 are “transferred” from the surface of the first resin to asurface of the second resin, and the composite material 1 in which theinorganic particles 20 are on a wall surface of the second resin can beobtained.

A temperature at which the precursor of the composite material is heatedis not limited to a particular temperature as long as the first resincan be softened at the temperature. The temperature may be, for example,95° C. to 130° C. or 120° C. to 160° C.

In the case where the precursor of the composite material is immersed ina particular solvent, the solvent is not limited to a particular solventas long as the solvent does not dissolve the second resin but candissolve the first resin. Examples of the solvent include toluene, ethylacetate, methyl ethyl ketone, and acetone.

The first resin (resin particle) may have a hollow structure. A hollowportion in the hollow structure may be a single hollow portion, or maybe formed of a plurality of hollow portions as a foamed resin bead is.When the resin particles having the hollow structure are used, a resinforming the first resins is softened by a heating treatment and thehollow portions therein disappear or shrink to form the plurality ofvoids 40. However, the hollow structure of the resin particle is notessential. In the case where the precursor of the composite material isimmersed in a particular solvent, it is preferable that the first resinbe, for example, more easily dissolved in the solvent than the secondresin. The void 40 having a desired shape is likely to be formed by thismethod. Examples of the material of the first resin include polystyrene(PS), polyethylene (PE), polymethyl methacrylate (PMMA), ethylene-vinylacetate copolymer (EVA), polyethylene (PE), polyvinyl chloride (PVC),polypropylene (PP), acrylonitrile-butadiene-styrene copolymer (ABS),ethylene-propylene-diene rubber (EPDM), and thermoplastic elastomers(TPE). The resin particle may be produced by a later-described method,or a commercially-available resin particle having a particular size maybe used as the resin particle. A raw material of the second resin is,for example, a crosslinking polymer, or any of the thermosetting resinsshown above as examples of the resin 30.

The size of the first resin is not limited to a particular one. When thefirst resin is spherical, the average diameter thereof is, for example,50 μm to 5000 μm, preferably 300 μm to 2000 μm, and particularly 500 μmto 1500 μm. The composite material 1 can have an appropriate void ratioby appropriate adjustment of the size of the first resin. In addition,the composite material can have the voids of an appropriate size byappropriate adjustment of the size of the first resin. Resin particlesof different sizes selected from the above sizes may be used as thefirst resins. That is, the plurality of first resins may havesubstantially similar outer shapes from each other. As a result, theplurality of voids 40 of the composite material 1 can have substantiallysimilar outer shapes from each other.

According to the method for manufacturing the composite material 1according to the present embodiment, at least a portion of the inorganicparticles 20 can face the void 40. Moreover, a heat transmission pathstretching through the plurality of voids 40 can be formed of theinorganic particles 20.

According to the method for manufacturing the composite material 1according to the present embodiment, the voids 40 are formed without afoaming step. That is, the voids 40 are not formed by foaming.

EXAMPLES

Hereinafter, the present invention will be described in more detail withreference to examples. The present invention is not limited to thefollowing examples.

(Production of Polystyrene Beads)

Into an autoclave equipped with a stirrer were added 100 parts by weightof pure water, 0.2 parts by weight of tricalcium phosphate, and 0.01parts by weight of sodium dodecylbenzene sulfonate. Into the autoclavewere added 0.15 parts by weight of benzoyl peroxide and 0.25 parts byweight of 1,1-bis(t-butylperoxy)cyclohexane as initiators to produce aliquid mixture. An amount of 100 parts by weight of a styrene monomerwas added to the liquid mixture while the liquid mixture was stirred at350 revolutions per minute. After that, the temperature of the solutionwas increased to 98° C. to perform a polymerization reaction. When thepolymerization reaction is about 80% complete, the temperature of thereaction solution was increased to 120° C. over 30 minutes. The reactionsolution was then maintained at 120° C. for 1 hour to produce astyrene-resin-particle-containing solution. Thestyrene-resin-particle-containing solution was cooled to 95° C., andthen 2 parts by weight of cyclohexane and 7 parts by weight of butane asblowing agents were introduced into the autoclave by pressure. Afterthat, the temperature of the solution was increased to 120° C. again.The solution was then maintained at 120° C. for 1 hour and then cooledto room temperature to obtain a polymerized slurry. The polymerizedslurry was dehydrated, washed, and dried to obtain expandable styreneresin particles. The expandable styrene resin particles were sieved toobtain expandable styrene resin particles having a particle diameter of0.2 mm to 0.3 mm. From the expandable styrene resin particles,sphere-like expanded polystyrene beads having an average diameter of 650μm to 1200 μm were obtained using a pressurized foaming machine (BHP)manufactured by Obiraki Industry Co., Ltd. The expanded polystyrenebeads were sieved using JIS test sieves having nominal aperture sizes(JIS Z 8801-1: 2019) of 1.18 mm and 1 mm. Expanded polystyrene beadspassing through the sieve having a nominal aperture size of 1.18 mm andnot passing through the sieve having a nominal aperture size of 1 mmwere used. Furthermore, the expanded polystyrene beads were sieved usingplain-woven metal meshes having aperture sizes of 0.69 mm and 0.63 mmand manufactured by Okutani Ltd. Expanded polystyrene beads passingthrough the metal mesh having an aperture size of 0.69 mm and notpassing through the metal mesh having an aperture size of 0.63 mm werealso used.

(Sample 1)

The sphere-like polystyrene beads (average diameter: 1000 μm) (bulkdensity: 0.025 g/cm³) as described above and polyethylene glycol(PEG-400 manufactured by Wako Pure Chemical Industries, Ltd.) wereweighed and added to a glass container at a weight ratio of 1:1. Themixture was stirred using a planetary centrifugal mixer (ARE-310)manufactured by THINKY CORPORATION. Next, scaly boron nitride (UHP-1K,average dimension of principal surfaces: 8 μm; thickness: 0.4 μm)manufactured by SHOWA DENKO K.K. was further added to the mixture sothat the polystyrene beads and the boron nitride would be in a weightratio of 1:2, and thus a mixture was prepared. The mixture was kneadedfor 5 minutes using a planetary centrifugal mixer at 2000 revolutionsper minute (rpm) to produce polystyrene beads coated with boron nitride.

A silicone resin (KE-106F) and silicone oil (KF-96-10CS) bothmanufactured by Shin-Etsu Chemical Co., Ltd. were added at a weightratio of 10:5. To the resulting mixture was further added a curing agent(CAT-106F) manufactured by Shin-Etsu Chemical Co., Ltd. so that thesilicone resin and the curing agent would be in the weight ratio of10:0.85, and thus a thermosetting resin was produced.

The polystyrene beads coated with boron nitride were charged in a 95mm×95 mm×24 mm plastic case, a plain-woven metal mesh (diameter: 0.18mm; 50-mesh) made of stainless steel and manufactured by YOSHIDA TAKA K.K. was laid on the plastic case, and a perforated metal (diameter: 5 mm;thickness: 1 mm; pitch: 8 mm) made of stainless steel was further laidon the plain-woven metal mesh. The plastic case, the plain-woven metalmesh, and the perforated metal were fixed with a clamp.

The above-described thermosetting resin was added into the plastic caseand defoamed under reduced pressure. The pressure applied was −0.08 MPato −0.09 MPa in gauge pressure. This process was repeated three times toimpregnate a gap between the polystyrene beads with the thermosettingresin. Next, the silicone resin was cured by heating at 80° C. for 2hours to obtain a resin molded article including polystyrene beads. Theresin molded article was cut to given dimensions. The resulting resinmolded article was heated at 130° C. for 30 minutes to soften thepolystyrene beads and let the polystyrene beads flow out of the resinmolded article. A composite material according to Sample 1 was producedin this manner.

(Samples 2 to 5)

Composite materials according to Samples 2 to 4 were each obtained inthe same manner as in Sample 1, except that the polystyrene beads andthe boron nitride described in Table 3 were used and a mixture wasprepared at a ratio described in Table 1. A composite material accordingto Sample 5 was obtained in the same manner as in Sample 1, except thatthe polystyrene beads and the boron nitride described in Table 3 wereused, a mixture was prepared at a ratio described in Table 1, and asilicone resin including 30 mass % of boron nitride was used instead ofthe thermosetting resin.

(Sample 6)

The polystyrene beads (average diameter: 1000 μm) as described above,boron nitride (UHP-1K, average dimension of principal surfaces: 8 μm;thickness: 0.4 μm) manufactured by SHOWA DENKO K.K., and a silicon resinas described above were weighed to amounts described in Table 1, addedto a glass container, and mixed. A composite material according toSample 6 was produced in the same manner as in Sample 1, except thatonly this mixture was charged in a plastic case.

(Sample 7)

Boron nitride (HGP; average dimension of principal surfaces: 5 μm;thickness: 0.1 μm) manufactured by Denka Company Limited, a siliconeresin, and ethanol were weighed to amounts described in Table 2, added,and mixed to prepare a mixture in a slurry state. The mixture was addedto a tubular mold having a bottom and having a diameter of 50 mm and aheight of 7 mm. Next, the mixture in the mold was heated at 100° C. for1 hour to foam the silicone resin by the ethanol and cure the foamedsilicone resin. A composite material according to Sample 7 was obtainedin this manner.

(Sample 8)

A composite material according to Sample 8 was obtained in the samemanner as in Sample 7, except that an unsaturated polyester resin(WP-2820) manufactured by Hitachi Chemical Company, Ltd. was usedinstead of the silicone resin and that the mixture was heated at 150° C.for 1 hour.

(Calculation of Amount [Volume %] of Inorganic Particles)

The amounts [volume %] of the inorganic particles in the compositematerials according to Samples 1 to 8 were determined in the followingmanner. First, an organic substance was removed from each of thecomposite materials according to Samples 1 to 8 to extract the inorganicparticles. The mass of the extracted inorganic particles was divided bythe density (2.3 g/cm³) of boron nitride to calculate the volume A ofthe inorganic particles. Separately, the volume B of the compositematerial was calculated from the volume and void ratio of the compositematerial, the volume B not including the volume of the voids 40. Theamount [volume %] of the inorganic particles in the composite materialwas determined by (A/B)×100.

(Calculation of Amount [Mass %] of Inorganic Particles)

The amounts [mass %] of the inorganic particles in the compositematerials according to Samples 1 to 8 were determined in the followingmanner. First, about 10 mg of each of the composite materials accordingto Samples 1 to 8 was weighed out and added to a fluorine resincontainer. Hydrofluoric acid was added to the fluorine resin container,which was then sealed. A microwave was applied to the fluorine resincontainer to perform acid decomposition under pressure at a highesttemperature of 220° C. Ultrapure water was added to the resultingsolution to adjust the volume to 50 mL. Boron in the solution wasquantified using ICP-AES SPS-3520UV manufactured by Hitachi High-TechScience Corporation to determine the amount [mass %] of the inorganicparticles.

(Heat Conductivity Measurement 1)

Heat conductivities of the composite materials according to Samples 1 to8 were measured for one test specimen in a symmetric configuration by aheat flow meter method using a heat conductivity measurement apparatusTCM1001 manufactured by RHESCA Co., LTD. according to the AmericanSociety for Testing and Materials (ASTM) standard D5470-01 (steady statelongitudinal heat flow method). Specifically, first, each compositematerial having a thickness t of 4000 μm was cut to 20 mm×20 mm toobtain a test piece. A silicone grease (SHC-20; heat conductivity: 0.84W/(m·K)) manufactured by Sunhayato Corp. was applied to both principalsurfaces of the test piece so that each of the resulting silicone greaselayers would have a thickness of 100 μm. An upper rod having a heatingblock (80° C.) and a lower rod having a cooling block (20° C.) were usedas standard rods. Blocks made of oxygen-free copper were used as testblocks. The test piece was sandwiched by the blocks made of oxygen-freecopper via the silicone grease layers to produce a measurement specimen.The measurement specimen was sandwiched between the upper rod and thelower rod. Heat was allowed to flow in the thickness direction of thetest piece.

A temperature difference ΔT_(S) between upper and lower surfaces of thetest piece was determined by the following equations (2) and (3). In theequations (2) and (3), ΔT_(C) is a temperature difference between theupper surface of the upper block (test block) made of oxygen-free copperand the lower surface of the lower block (test block) made ofoxygen-free copper. Additionally, q₁ represents a heat flux [W/m²]determined by a temperature gradient calculated based on temperaturedifferences between a plurality of temperature measurement points on theupper rod, and q₂ represents a heat flux [W/m²] determined by atemperature gradient calculated based on temperature differences betweena plurality of temperature measurement points on the lower rod. A symbolt_(b) represents the sum of the thicknesses of the blocks made ofoxygen-free copper. A symbol k_(b) represents the heat conductivity ofthe blocks made of oxygen-free copper.

ΔT _(S) =ΔT _(C)−(q _(S) ×t _(b))/k _(b)  Equation (2)

q _(S)=(q ₁ +q ₂)/2  Equation (3)

A heat conductivity λ₁ [W/(m·K)] in the thickness direction of the testpiece was determined by the following equation (4). Tables 3 and 4 showthe values Ai of heat conductivities obtained by the above (Heatconductivity measurement 1).

λ₁ =q _(S) ×t/ΔT _(S)  Equation (4)

(Measurement of Compressive Elastic Modulus)

Compressive elastic moduli of the composite materials according toSamples 1 to 8 were measured using a dynamic viscoelastic measurementapparatus RSA G2 manufactured by TA Instruments Japan Inc. A 25 mm²principal surface of each composite material having a thickness of 4 mmwas compressed by 0% to 5% at a compression rate of 0.01 mm/s. A strainx of the composite material and a stress y of the composite materialwere measured for every 0.2% compression of the principal surface of thecomposite material. From the strains x of the composite material and thestresses y of the composite material at measurement points, anarithmetic average x_(ave) of the strains x of the composite materialand an arithmetic average y_(ave) of the stresses y of the compositematerial, respectively, were calculated. An elastic modulus b wascalculated by the following equation (5).

b=Σ{(x−x _(ave))(y−y _(ave))}÷Σ(X−x _(ave))²  Equation (5)

(Reaction Force at 10% Compression)

A pressure on each of the composite materials according to Samples 1 to8 being at room temperature, having a thickness of 4 mm, and having a100 mm² principal surface was measured using a dynamic viscoelasticmeasurement apparatus RSA G2 manufactured by TA Instruments Japan Inc.after the composite material was compressed by 10% of the thicknessthereof for 30 seconds. The pressure was defined as a reaction force.

(Measurement of Asker C Hardness)

Asker C hardnesses of test pieces formed of the composite materialsaccording to Samples 1 to 8 were measured according to JapaneseIndustrial Standards (JIS) K 7312: 1996 using ASKER Durometer Type Cmanufactured by KOBUNSHI KEIKI CO., LTD. Each test piece used in themeasurement was a laminate of three 4-mm-thick pieces of the compositematerial. Tables 3 and 4 show the results.

The composite materials according to Samples 1 to 5 have a compressiveelastic modulus of 100 kPa to 600 kPa. Additionally, the compositematerials according to Samples 1 to 5 have a heat conductivity of 0.5W/(m·K) or more. These reveal that the composite materials according toSamples 1 to 5 easily change their shapes in response to a compressiveforce.

As shown in FIG. 4 , the composite material according to Sample 1includes a solid portion including inorganic particles and a resin, andincludes a plurality of voids surrounded by the solid portion. In thecomposite material according to Sample 1, the voids have substantiallysimilar outer shapes to each other. Additionally, the outer shapes ofthe voids are substantially spherical. Moreover, the plurality of voidsare in contact with each other directly or via the inorganic particle.

TABLE 1 Sample Sample Sample Sample Sample Sample 1 2 3 4 5 6Polystyrene beads [mass %] 7 10 5 6 7 5 Polyethylene glycol [mass %] 7 55 5 7 5 Boron nitride [mass %] 14 32 34 21 15 20 Resin [mass %] 72 53 5668 40 70

TABLE 2 Sample 7 Sample 8 Boron nitride [mass %] 60 61 Silicone resin[mass %] 39 — Unsaturated polyester resin [mass %] — 38 Ethanol [mass %] 1  1

TABLE 3 Sample Sample Sample Sample Sample Sample 1 2 3 4 5 6 Averagediameter [μm] of voids 1000 650 1000 1000 1000 1000 Void ratio [volume%] 27 30 29 25 34 47 Inorganic Aspect ratio 20 7 7 65 20 20 particlesAverage particle diameter [μm] — — — — — — Average dimension [μm] of 80.7 0.7 13 8 8 principal surfaces Thickness [μm] 0.4 0.1 0.1 0.2 0.4 0.4Amount [mass %] 14 32 34 21 45 20 Amount [volume %] 6 10 12 8 23 7 Heatconductivity λ₁ [W/(m · K)] 1.32 1.93 1.73 1.15 1.85 0.14 P₀ 34 279 41419 43 59 Compressive elastic modulus [kPa] 490 293 316 495 562 91 AskerC hardness 27 20 30 42 43 6

TABLE 4 Sample 7 Sample 8 Average diameter of voids [μm] 200 200 Voidratio [volume %] 50 50 Inorganic Aspect ratio 50 50 particles Averagedimension [μm] 5 5 of principal surfaces Thickness [μm] 0.1 0.1 Amount[mass %] 60 61 Amount [volume %] 31 36 Heat conductivity λ₁ [W/(m · K)]2.27 2.36 P₀ 20 20 Compressive elastic modulus [kPa] 757 2450 Asker Chardness 55 96

(Preparation of Aqueous-Dispersion-Type Acrylic Adhesive)

An amount of 40 parts by weight of ion-exchange water was placed in areaction container equipped with a cooling pipe, a nitrogen introductionpipe, a thermometer, and a stirrer, and was stirred at 60° C. for 1 houror longer while a nitrogen gas was being introduced thereto for nitrogenpurging. To the reaction container was added 0.1 parts by weight of2,2′-azobis[N-(2-carboxyethyl)-2-methylpropionamidine]n-hydrate(polymerization initiator) to prepare a liquid mixture. A monomeremulsion A was dropped little by little over 4 hours for an emulsionpolymerization reaction while this liquid mixture was maintained at 60°C. A reaction solution was thus obtained. The monomer emulsion A usedwas obtained by adding 98 parts by weight of 2-ethylhexyl acrylate, 1.25parts by weight of acrylic acid, 0.75 parts by weight of methacrylicacid, 0.05 parts by weight of lauryl mercaptan (chain transfer agent),0.02 parts by weight of γ-methacryloxypropyltrimethoxysilane (productname “KBM-503” manufactured by Shin-Etsu Chemical Co., Ltd.), and 2parts by weight of polyoxyethylene sodium lauryl sulfate (emulsifier) to30 parts by weight of ion-exchange water and emulsifying the mixture.After all the monomer emulsion A was dropped, the reaction solution wasfurther maintained at 60° C. for 3 hours and was then cooled to roomtemperature. Next, 10% ammonia water was added to the reaction solution,and the pH of the reaction solution was adjusted to 7 to obtain anacrylic polymer emulsion (aqueous-dispersion-type acrylic polymer) A. Anamount of 10 parts by weight, on a solids basis, of a resin emulsion(product name “E-865NT” manufactured by ARAKAWA CHEMICAL INDUSTRIES,LTD.) for imparting adhesiveness was added per 100 parts by weight of anacrylic polymer included in the acrylic polymer emulsion A to obtain amixture. Furthermore, distilled water was added to the mixture so that aweight ratio of the mixture to the distilled water would be 10:5. Anaqueous-dispersion-type acrylic adhesive was obtained in this manner.

(Sample 9)

The above-described sphere-like polystyrene beads (average diameter:1000 μm) (bulk density: 0.025 g/cm³) and the aqueous-dispersion-typeacrylic adhesive were weighed and added to a glass container at a weightratio of 1:1. The mixture was added to UNIPACK L-4 manufactured bySEISAN NIPPONSHA LTD. The UNIPACK was sealed and shaken for 5 minutes byhand to mix the mixture. Next, scaly boron nitride (UHP-1K, averagedimension of principal surfaces: 8 μm; thickness: 0.4 μm) manufacturedby SHOWA DENKO K.K. was further added to the mixture in the UNIPACK sothat the polystyrene beads and the boron nitride would be in a weightratio of 7:19, and thus a mixture was prepared. The UNIPACK was shakenfor 5 minutes by hand to produce polystyrene beads coated with boronnitride.

A silicone resin (KE-106F) and silicone oil (KF-96-10CS) bothmanufactured by Shin-Etsu Chemical Co., Ltd. were added at a weightratio of 10:5. A curing agent (CAT-106) manufactured by Shin-EtsuChemical Co., Ltd. was further added to the mixture so that the siliconeresin and the curing agent would be in a weight ratio of 10:0.17, andthus a thermosetting resin was produced.

The polystyrene beads coated with boron nitride were charged in a 95mm×95 mm×24 mm plastic case, a plain-woven metal mesh (diameter: 0.18mm; 50-mesh) made of stainless steel and manufactured by YOSHIDA TAKA K.K. was laid on the plastic case, and a perforated metal (diameter: 5 mm;thickness: 1 mm; pitch: 8 mm) made of stainless steel was further laidon the plain-woven metal mesh. The plastic case, the plain-woven metalmesh, and the perforated metal were fixed with a clamp.

The above-described thermosetting resin was added into the plastic caseand defoamed under reduced pressure. The pressure applied was −0.08 MPato −0.09 MPa in gauge pressure. This process was repeated three times toimpregnate a gap between the polystyrene beads with the thermosettingresin. Next, the silicone resin was cured by heating at 80° C. for 2hours to obtain a resin molded article including polystyrene beads. Theresin molded article was cut to given dimensions. The cut resin moldedarticle was completely immersed in ethyl acetate for 30 minutes todissolve the polystyrene beads and let the polystyrene beads flow out ofthe resin molded article. After that, the resin molded article was driedat 90° C. for 3 hours. A composite material according to Sample 9 wasproduced in this manner.

(Sample 10)

A composite material according to Sample 10 was obtained in the samemanner as in Sample 9, except that the polystyrene beads and the boronnitride described in Table 5 were used and a mixture was prepared at aratio described in Table 5.

(Samples 11 and 12)

Composite materials according to Samples 11 and 12 were each obtained inthe same manner as in Sample 9, except that the polystyrene beads andthe boron nitride described in Table 5 were used, a urethane resinUF-820A manufactured by Sanyu Rec Co., Ltd. and a curing agent (UF-820B)mixed at a weight ratio of 5.35:10 were used instead of thethermosetting resin, and a mixture was prepared at a ratio described inTable 5.

(Samples 13 to 19)

Boron nitride, a silicone resin, and ethanol were weighed to amountsdescribed in Table 6, added, and mixed to prepare a mixture in a slurrystate. The mixture was added to a tubular mold having a bottom andhaving a diameter of 50 mm and a height of 7 mm. Next, the mixture inthe mold was heated at 100° C. for 1 hour to foam the silicone resin bythe ethanol and cure the foamed silicone resin. Composite materialsaccording to Samples 13 to 19 were obtained in this manner.

(Heat Conductivity Measurement 2)

Heat conductivities of the composite materials according to Samples 9 to19 were measured for one test specimen in a symmetric configuration by aheat flow meter method using a heat conductivity measurement apparatusTCM1001 manufactured by RHESCA Co., LTD. according to the AmericanSociety for Testing and Materials (ASTM) standard D5470-01 (steady statelongitudinal heat flow method). Specifically, first, each compositematerial having a thickness t was cut to 20 mm×20 mm to obtain a testpiece. A silicone grease (SHC-20; heat conductivity: 0.84 W/(m·K))manufactured by Sunhayato Corp. was applied to both principal surfacesof the test piece so that each of the resulting silicone grease layerswould have a given thickness equal to or less than 300 μm. An upper rodhaving a heating block (110° C.) and a lower rod having a cooling block(20° C.) were used as standard rods. Blocks made of oxygen-free copperwere used as test blocks. The test piece was sandwiched by the blocksmade of oxygen-free copper via the silicone grease layers to produce ameasurement specimen. The measurement specimen was sandwiched betweenthe upper rod and the lower rod. Heat was allowed to flow in thethickness direction of the test piece.

A temperature difference ΔT_(S) between upper and lower surfaces of thetest piece was determined by the following equations (6) and (7). In theequations (6) and (7), ΔT_(C) is a temperature difference between theupper surface of the upper block (test block) made of oxygen-free copperand the lower surface of the lower block (test block) made ofoxygen-free copper. Additionally, q₁ represents a heat flux [W/m²]determined by a temperature gradient calculated based on temperaturedifferences between a plurality of temperature measurement points on theupper rod, and q₂ represents a heat flux [W/m²] determined by atemperature gradient calculated based on temperature differences betweena plurality of temperature measurement points on the lower rod. A symbolt_(b) represents the sum of the thicknesses of the blocks made ofoxygen-free copper. A symbol k_(b) represents the heat conductivity ofthe blocks made of oxygen-free copper.

ΔT _(S) =ΔT _(C)−(q _(S) ×t _(b))/k _(b)  Equation (6)

q _(S)=(q ₁ +q ₂)/2  Equation (7)

A heat conductivity λ₂ [W/(m·K)] in the thickness direction of the testpiece was determined by the following equation (8).

λ₂ =q _(S) ×t/ΔT _(S)  Equation (8)

Tables 5 and 6 show the values λ₂ of heat conductivities obtained by theabove (Heat conductivity measurement 2). The thickness t of each testpiece was determined by measurement using a camera.

(Composition Analysis)

Using an ultra-high-resolution field-emission scanning electronmicroscope (SU8220) manufactured by Hitachi High-TechnologiesCorporation, particular regions of each of the composite materialsaccording to Samples 1 to 19 were measured and the proportion of an atomincluded in the inorganic particle(s) included in each particular regionof the composite material was calculated by energy dispersive X-rayspectroscopy. First, a measurement region was determined by the abovemethod for each of the composite materials according to Samples 1 to 19.The proportion of an atom included in the inorganic particle(s) wasmeasured in this measurement region. When the inorganic particle(s) areformed of boron nitride, the measured atom was boron (B). Y/X wascalculated, where Y represents the largest proportion [atomic %] of theatom included in the inorganic particle(s) and X represents the smallestproportion [atomic %] of the atom included in the inorganic particle(s)in the measurement region. Additionally, the value Q was calculated bythe above method. Tables 5 to 7 show the results.

The composite materials according to Samples 9 to 19 were measured forthe compressive elastic modulus, the reaction force at 10% compression,and the Asker C hardness by the above methods. Tables 5 and 6 show theresults.

The composite materials according to Samples 9 to 12 compressed by 10%have a reaction force of 0.1 kPa to 1000 kPa. Additionally, thecomposite materials according to Samples 9 to 12 have a heatconductivity of 0.5 W/(m·K) or more. Moreover, the composite materialsaccording to Samples 9 to 12 have a compressive elastic modus of 100 kPato 600 kPa. These reveal that the composite materials according toSamples 9 to 12 easily change their shapes in response to a compressiveforce.

The composite materials according to Samples 1 to 5 compressed by 10%have a reaction force of 0.1 kPa to 1000 kPa. Additionally, thecomposite materials according to Samples 1 to 5 have a heat conductivityof 0.5 W/(m·K) or more.

TABLE 5 Sample Sample Sample Sample 9 10 11 12 Polystyrene beads [mass%] 7 10 7 7 Aqueous-dispersion-type 7 5 7 7 acrylic adhesive [mass %]Boron nitride [mass %] 19 28 20 14 Resin [mass %] 67 57 66 72 Averagediameter of voids [μm] 1000 650 1000 1000 Void ratio [volume %] 27 30 2727 Inorganic Aspect ratio 20 7 20 50 particles Average 8 0.7 8 5dimension [μm] of principal surfaces Thickness [μm] 0.4 0.1 0.4 0.1Amount [mass %] 19 28 20 12 Amount [volume %] 7 9 7 4 Heat conductivityλ₂ [W/(m · K)] 1.02 1.21 1.09 0.89 P₀ 34 279 34 54 Reaction force [kPa]at 10% 3 5 4 8 compression Asker C hardness 4 4 4 5 Y/X 4.7 9.4 5.1 5.9Q 82.5 90.4 83.6 85.5

TABLE 6 Sample Sample Sample Sample Sample Sample Sample 13 14 15 16 1718 19 Boron nitride [mass %] 60 14 20 20 20 34 60 Silicone resin [mass%] 39 84 78 78 78 64 38 Ethanol [mass %] 2 2 2 2 2 2 2 Average diameter[μm] of voids 200 200 200 200 200 200 200 Void ratio [volume %] 50 50 5050 50 50 50 Inorganic Aspect ratio 50 50 20 7 50 7 20 particles Averagedimension [μm] of 5 5 8 0.7 5 0.7 8 principal surfaces Thickness [μm]0.1 0.1 0.4 0.1 0.1 0.1 0.4 Amount [mass %] 60 14 20 20 20 34 60 Amount[volume %] 31 6 7 7 7 12 32 Heat conductivity λ₂ [W/(m · K)] 1.79 0.120.13 0.12 0.13 0.38 1.24 P₀ 20 20 13 143 20 143 13 Reaction force [kPa]at 10% compression 14000 90 110 100 130 260 17000 Asker C hardness 42 67 6 7 12 54 Y/X 1.2 1.3 1.5 1.3 1.4 1.3 1.2 Q 55.1 55.7 60.5 55.9 57.656.8 55.3

TABLE 1 Sample Sample Sample Sample Sample Sample Sample Sample 1 2 3 45 6 7 8 Reaction force [kPa] 421 174 384 490 882 10 18000 262000 at 10%compression Y/X 4.4 9.2 5.7 5.9 1.4 1.3 1.8 1.3 Q 81.6 90.2 85.0 85.458.9 56.4 64.4 56.2

1. A composite material comprising a solid portion including inorganic particles and a resin, wherein the composite material has a porous structure including a plurality of voids surrounded by the solid portion, the composite material compressed by 10% has a reaction force of 0.1 kPa to 1000 kPa, and the composite material has a heat conductivity of 0.5 W/(m·K) or more, where the heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard D5470-01.
 2. A composite material comprising a solid portion including inorganic particles and a resin, wherein the composite material has a porous structure including a plurality of voids surrounded by the solid portion, the composite material has a compressive elastic modulus of 100 kPa to 600 kPa, and the composite material has a heat conductivity of 0.5 W/(m·K) or more, where the heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard D5470-01.
 3. The composite material according to claim 1, wherein at least a portion of the inorganic particles is present on a wall surface of the solid portion, the wall surface facing the void, the plurality of voids are in contact with each other directly or via the inorganic particle, and a heat transmission path stretching through the plurality of voids is formed of the inorganic particles in contact with each other.
 4. The composite material according to claim 1, wherein a value P₀ determined by the following equation (1) is 30 or more: P ₀=(the average diameter[μm]of the voids 40/the average particle diameter[μm]of the inorganic particles 20)×(the void ratio[volume %]/100)  Equation (1)
 5. The composite material according to claim 4, having a heat conductivity of 0.5 W/(m·K) or more.
 6. The composite material according to claim 1, having an Asker C hardness of 10 to
 50. 7. The composite material according to claim 1, wherein the plurality of voids have substantially similar outer shapes.
 8. The composite material according to claim 7, wherein the outer shape of the void is substantially spherical.
 9. The composite material according to claim 3, wherein substantially all the inorganic particles are each present on the wall surface or at a connecting portion between the voids.
 10. The composite material according to claim 1, wherein the composite material is a non-foam body.
 11. The composite material according to claim 1, wherein the voids have an average diameter of 50 μm to 5000 μm, and the inorganic particles have an average particle diameter of 0.1 μm to 50 μm.
 12. The composite material according to claim 1, wherein the inorganic particle has an aspect ratio of 1 or more and less than
 50. 13. The composite material according to claim 1, having a void ratio of 10 volume % to 60 volume %.
 14. The composite material according to claim 2, wherein at least a portion of the inorganic particles is present on a wall surface of the solid portion, the wall surface facing the void, the plurality of voids are in contact with each other directly or via the inorganic particle, and a heat transmission path stretching through the plurality of voids is formed of the inorganic particles in contact with each other.
 15. The composite material according to any one of claim 2, wherein a value P₀ determined by the following equation (1) is 30 or more: P ₀=(the average diameter[μm]of the voids 40/the average particle diameter[μm]of the inorganic particles 20)×(the void ratio[volume %]/100)  Equation (1)
 16. The composite material according to claim 2, having an Asker C hardness of 10 to
 50. 17. The composite material according to claim 2, wherein the plurality of voids have substantially similar outer shapes.
 18. The composite material according to claim 2, wherein the composite material is a non-foam body.
 19. The composite material according to claim 2, wherein the voids have an average diameter of 50 μm to 5000 μm, and the inorganic particles have an average particle diameter of 0.1 μm to 50 μm.
 20. The composite material according to claim 2, wherein the inorganic particle has an aspect ratio of 1 or more and less than
 50. 21. The composite material according to claim 2, having a void ratio of 10 volume % to 60 volume %. 